Andy Feng Chen

Andy Feng Chen studied Electrical and Computer Engineering (B.S.) and Computer Science (B.A.) at the University of Rochester (Class of 2026), where he conducted research in terahertz time-domain spectroscopy and nanoelectronic devices, including experimental spectroscopy and materials characterization, as well as thin-film fabrication using RF sputtering to investigate semiconductor device properties and performance.

In Summer 2026, he worked at Amazon Web Services (AWS) as a Signal and Power Integrity Hardware Engineer, focusing on silicon validation, power delivery characterization, and signal integrity analysis for chiplet-based interconnects and advanced packaging technologies.

In Fall 2026, he joined the Lipson Nanophotonics group at Columbia University, where he hopes to explore the intersection of photonics and computing and how photonic devices can enable faster and more efficient computing systems.

Besides his studies and research, he enjoys playing volleyball, rock climbing, trying new foods, and spending time with his cat.